Mechatronic Modules

Get the most out of Flexible Printed Circuit technology: our rich portfolio of interconnection and assembly technologies turn Flexible Printed Circuit boards into value adding Mechatronic Modules. By the way, you do not have to be an electronics specialist to benefit from our modules: our experienced developers support you right from scratch.

We Love Challenges

Maybe it is due to our Japanese roots and our passion for origami arts: designing Flexible Printed Circuit boards that fit to complex 3D structures or assembly spaces is part of our developers’ DNA. Our passion is your benefit. We take care of the board’s 3D design (2D unrolling) while you concentrate on your core business.

Crimp Connectors

Interconnecting Mektec's Flexible Printed Circuits just like common round cables. Our crimping technology allows you to choose from a wide range of established connector systems that perfectly match your requirements. Supervised by our unique monitoring systems we crimp each terminal individually. All crimp contacts fulfill or even exceed highest automotive requirements (VDA AK guideline).

Adding Components: Soldering

Only the possibility to equip Flexible Printed Circuit boards with discrete components and integrated circuits turns them into a full-featured alternative to conventional rigid printed circuit boards. We offer different soldering techniques to add components to our FPC boards: reflow, selective wave and iron soldering.

Learn more about soldering at Mektec

Reflow soldering is the standard for cost-effective SMD component assembly of printed circuit boards in large quantities. At Mektec, this process is also available for assembly of Flexible Printed Circuit boards. We assemble printed circuit boards based on polyimide and even based on the more cost effective polyethylene naphthalate - particularly interesting for very large printed circuit boards. Optically monitored solder paste printing as well as comprehensive traceability are for sure.

Wave Soldering

Selective wave soldering integrates conventional circuit board headers and connectors to the flexible circuit board.

Iron Soldering

Automated iron soldering with controlled solder feed is ideal to connect stranded wires or coaxial cables for connecting high frequency applications.

Protect & Seal

Our Flexible Printed Circuit boards are resistant to harsh environmental influences and diverse substances, therefore they often interconnect installation spaces with different sealing requirements. As Mektec's FPC boards are ultra-thin and feature various sealing technologies, they are ideal to fulfill demanding requirements for tightness and protection of installation spaces. Additionally, our sealings protect sensitive components and electrical interfaces.

More information on protection & sealing

Hot-melt

Thermoplastic adhesives are heated and applied by a tool-guided process. The result is a geometrically and precisely defined encapsulation on the flexible circuit board. This technology is ideal for the sealing of soldered cable joints and of connectors.

Grommet Assembly

Grommets are often used to seal the transition between two different installation spaces. The grommets that have already been designed for round cables can be easily adapted to our Flexible Printed Circuit boards by adding a hot-melt structure.

Conformal Coating

Conformal coating consists of thin layers of polymeric materials. We use this process to protect electrical components against corrosion and mechanical stress.

FPC-To-X: It's A Match!

Flexible Printed Circuit boards offer many great features. However, only in combination with our unique and comprehensive set of reliable automotive proven interconnection technologies we create extra added value for our customers with complete assemblies or Mechatronic Modules. No matter what challenges, we find a "fit-for-use" solution – enabling mechatronics.

Final Assembly

Mektec's comprehensive connection technologies are complemented by numerous assembly technologies. Wherever possible, we rely on (partial) automation of the assembly processes - of course including computer-monitored process parameters and complete traceability.

Heat staking is ideal for mounting Flexible Printed Circuit boards on plastic carriers while screw fixation perfectly fits to metal components (e.g. heatsinks). Adhesive bonding may be an alternative for both carrier designs.

Heat Staking

Through a heat staking process, we achieve a permanent form-fit connection of our circuit boards with plastic carriers. Individual plastic pins are fed through holes in the circuit board and deformed with heat. The result is a stable fixation of the circuit board.

Screw Fixing

We offer screw fixation when high positioning accuracy is required in certain areas of the Flexible Printed Circuit (e.g. LED reference to reflector). A partly stiffened Flexible Printed Circuit board is screwed together with plastic or metal carriers (e.g. heat sink). The process is torque-controlled, of course.

Adhesive Assembly

Gluing is one of the most convenient methods of fixing flexible circuit boards to plastic or metal carriers. However, it requires rich expertise in proper selection and application of an appropriate adhesive. No matter if small pads or full-surface application, wafer-thin and thicker-foam adhesives or thermally conductive materials - Mektec is your right partner.